“The Helio X30 supports up to 8GB of RAM, up to 40MP camera sensors, and LTE Cat. 12 connectivity”

In May last year, popular mobile chipset manufacturer MediaTek unveiled the Helio X20 as its first SoC with a deca-core CPU. At the launch, MediaTek claimed that the Helio X20 was the world’s first chipset to feature a tri-cluster CPU architecture. Earlier this year, the brand unveiled the Helio X25 as an upgraded version of the Helio X20 SoC, which first shipped with the MEIZU Pro 6. Now the company has announced the Helio X30 chipset.

Similar to its predecessors, the Helio X30 SoC also features a deca-core CPU and a tri-cluster design. However, while the Helio X20 and X25 were built using the 20nm manufacturing process, the Helio X30 is built using TSMC’s 10nm FinFET process. The Helio X30 contains a 10-core CPU with four Cortex A-73 cores running at 2.8GHz to handle heavy tasks, four Cortex A-35 clusters spinning at 2.2GHz, and two Cortex-A35 cores running at 2GHz.

The Helio X30 chipset can support up to 8GB of RAM, and comes with a PowerVR 7XT GPU, which is expected to be more than compatible with VR devices. The SoC supports camera sensors up to 40-megapixels, and video recording as high as 24MP. The phones utilising this SoC with 16MP cameras will be able to record videos at up to 60 fps, and 8MP cameras will support up to 120 fps video recording.

MediaTek’s latest Helio X30 SoC also comes with a modem that supports LTE Cat. 12 connectivity and three carrier aggregation. As per the reports, the Helio X30 is expected to hit the market next year, and the first smartphones to utilise it are expected to be launched in the second half of 2017. 

Via